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Manufacturing challenges in electronic packaging
[NT 42944] Record Type:
[NT 1579] Language materials, printed : [NT 40817] monographic
[NT 47354] Secondary Intellectual Responsibility:
LeeY. C.,
[NT 47354] Secondary Intellectual Responsibility:
ChenW. T.,
[NT 47351] Place of Publication:
London
[NT 47263] Published:
Chapman & Hall;
[NT 47352] Year of Publication:
1998
[NT 47264] Description:
x, 261 p.ill. : 24 cm.;
[NT 47266] Subject:
Manufacturing processes. -
[NT 47266] Subject:
Electronic packaging. -
[NT 50961] ISBN:
0-412-62030-8bound
Manufacturing challenges in electronic packaging
Manufacturing challenges in electronic packaging
/ Y.C. Lee, W.T. Chen, [editors] - London : Chapman & Hall, 1998. - x, 261 p. ; ill. ; 24 cm..
Includes bibliographical references and index..
ISBN 0-412-62030-8
Manufacturing processes. Electronic packaging.
Lee, Y. C.
Manufacturing challenges in electronic packaging
LDR
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CCR
[NT 59758] based on 0 [NT 59757] review(s)
[NT 60002] ALL
總館A區6F
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